มอก. 2698-2558

Scope (English)

This standard specifies the requirements for chemical composition for the following families of soft solder alloys: tin-lead, with and without antimony, bismuth, cadmium, copper, and silver; tin-antimony; tinbismuth; tin-copper, with and without silver; tin-indium, with and without silver and bismuth; tin-silver, with and without copper and bismuth; tinzinc, with and without bismuth. This standard also includes an indication of the forms generally available.